| 11. 04. 08 |
Digitally programmable buck regulator |
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Fairchild Semiconductor gives system design engineers a power management solution for Dynamic Voltage Scaling (DVS) platforms found in today's cell phones, portable media players (PMPs) and other port...
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| 09. 04. 08 |
20-V power MOSFET in chipscale package |
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Vishay released a 20-V p-channel TrenchFET power MOSFET in a MICRO FOOT chipscale package. The Si8441DB offers an 0.59-mm profile and a footprint area of 1.5mm by 1mm. It is also the first device of i...
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| 09. 04. 08 |
Aluminium electrolytic capacitors for 260ºC reflow processes |
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Several case sizes from NIC Component’s NAZT series of surface mount aluminium electrolytic capacitors are now rated to 260ºC – the current maximum recommended temperature for Sn-Ag-Cu (SAC) alloy lea...
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| 02. 04. 08 |
Single/Dual MOSFET drivers in a TDFN package |
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Maxim Integrated Products introduces the MAX15024/MAX15025 single/dual MOSFET drivers in a thermally enhanced, 3mm x 3mm, TDFN package. The MAX15024 is a single gate driver capable of sinking up to 8A...
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| 01. 04. 08 |
30V LDOs with 43.5V Load-Dump Protection |
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Microchip announces MCP1790 and MCP1791 high-voltage linear regulators (LDOs). With a continuous 70 mA output, the ability to operate at a continuous input voltage of up to 30V and load-dump protectio...
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| 31. 03. 08 |
High brightness LEDs with up to 350mA |
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Maxim Integrated Products introduces the MAX16815/MAX16828/MAX16835/MAX16836 high-voltage, linear high-brightness LED (HB LED) drivers capable of driving a long string of HB LEDs from a 6.5V to 40V in...
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| 27. 03. 08 |
Miniature photocoupler in SDIP |
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Toshiba Electronics Europe (TEE) has launched a miniature photocoupler that delivers the same isolation and current outputs as previous DIP packaged devices in a form factor that is 50% smaller. The T...
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