| 12. 09. 05 |
Graphite Thermal Solution |
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GrafTech International introduces SpreaderShield, a thermal management solution joining its eGraf product line. SpreaderShield is a natural graphite solution that distributes heat evenly in two dimens...
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| 12. 09. 05 |
Altium Designer supports Lattice FPGA devices |
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Altium announced support for Lattice Semiconductor’s LatticeEC and LatticeECP FPGA devices as part of its Service Pack 4 (SP4) for Altium Designer. This support for LatticeEC/ECP devices also enhances...
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| 12. 09. 05 |
Colloquium: Automobile and engine technology |
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A colloquium on automobile and engine technology will be held in Aachen, Germany from the 4th to the 6th of October. It will be organized by the Institut für Kraftfahrwesen (ika) [Institue of automobi...
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| 09. 09. 05 |
International automotive quality standard |
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The trade association Electronic Components and Electronic Industry, ZVEI (Zentralverband Elektrotechnik- und Elektronikindustrie) is working on a new quality standard for semiconductor products in au...
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| 09. 09. 05 |
C&D Technologies: Financial results second quarter 2006 |
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C&D Technologies a producer and marketer of electrical power storage and conversion products announced financial results for the second quarter ended July 31, 2005. For the three-month period, the com...
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| 09. 09. 05 |
Stacking: 3D-SiP with 0.5 mm ball pitch |
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Sharp developed a 0.5 mm ball pitch technology for 3D systems-in-package (3D-SiP). What has been very difficult to implement with SiP technologies is now possible: the stacking of DSP, Flash memory an...
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| 08. 09. 05 |
Parametric Evaluation Tool for op amps from Analog Devices |
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Analog Devices announced the availability of a parametric evaluation tool for amplifiers. It enables system designers to select, evaluate and troubleshoot voltage feedback operational amplifiers from ...
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