| 17. 10. 06 |
Kemet to reduce headcount in its Monterrey facilities |
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Kemet announced a cost-reduction initiative in its Monterrey, Mexico, facilities that will reduce headcount by approximately 400 people. This will be accomplished through a combination of normal attri...
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| 17. 10. 06 |
3.2-megapixel and 2.0-megapixel CMOS image sensor |
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Toshiba Electronics Europe has announced the expansion of its Dynastron complementary metal oxide semiconductor (CMOS) image sensor product line with the addition of two new chips: the 3.2-megapixel E...
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| 17. 10. 06 |
Third quarter 2006 at Micronas |
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In the third quarter of the current year the Micronas Group increased net sales to CHF 222.9 million, up 17.4 percent on the previous quarter. Operating profit before interest and taxes (EBIT) reached...
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| 17. 10. 06 |
Support for multi-radio handset designs |
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Texas Instruments announced the extension of its OMAP Technology Center (OTC) program to include support of TI’s WLAN, Bluetooth technology and mobile TV solutions. OTCs can now become authorized to p...
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| 17. 10. 06 |
Semiconductor market in Germany in September 2006 |
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According to the ZVEI - Zentralverband Elektrotechnik- und Elektronikindustrie in Germany, the turnover of semiconductors in September, seasonably adjusted, was slightly above that of the previous mon...
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| 17. 10. 06 |
Memphis Electronic: New management for sales and marketing |
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Memphis electronics has named Marco Mezger as Director Sales and Marketing Mezger comes from xsmart where he was CEO. Before that he gained experience in distribution and sales at Smith and Associates...
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| 16. 10. 06 |
Driver IC family for high-temperature applications |
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Atmel announced the availability of three driver ICs for high-temperature applications (AECQ100, Grade 0). The ATA6824, ATA6827 and ATA6832 are able to withstand extremely high chip temperatures of up...
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