Altera announced second quarter sales of $279.2 million, up 6 percent from the first quarter of 2009 and down 22 percent from the second quarter of 2008. Second quarter net income was $47.4 million, up from net income of $44.0 million in the first quarter of 2009 and down from $98.0 million in the s...

AuthenTec, a provider of smart fingerprint sensors and solutions, has completed a transaction to acquire the assets of fingerprint sensor maker Atrua Technologies for approximately $4.9 million in cash. The asset purchase further extends AuthenTec’s position in the wireless market and adds to its ex...

Exar has completed a distribution agreement with Microdis Electronics, a specialist in distribution of electronic components in Eastern Europe. Microdis will distribute Exar's products through its sales network in Bulgaria, Czech Rep., Hungary, Poland, Slovakia, Serbia, Slovenia, Romania, Russia, Al...

MIPS Technologies announced that President and CEO John Bourgoin intends to retire at the end of the calendar year. The Company's board of directors plans to begin an immediate search for a successor, which is expected to take three to six months. Bourgoin will remain president and CEO through the e...

Expanding its Datel offering of Digital Panel Meters, Murata Power Solutions has introduced a new series of four-function AC Power Meters. The ACM20 series is able to measure and display AC Volts, Amps, Watts and Power Factor with a typical accuracy of ±0.5% full-scale. Unlike conventional average-r...

STMicroelectronics has introduced a IC that delivers superior sound quality from portable music players and feature-phones by excluding high-frequency interference from cellphones. The EMIF04-EAR02M8, measuring 1.5 x 1.7mm, can replace a network of discrete components or two separate ICs, normally d...

Renesas Technology Europe announced the development of its SiP Top-Down Design Environment to boost efficiency when developing system in package (SiP) products combining multiple chips, such as system on chip (SoC) devices, MCUs, and memories, in a single package. It uses a top-down (predictive) des...