Chomerics has introduced two thermally conductive gap filling materials that combine low force deflection and thermal conductivity to provide a solution that gives a level of thermal management that m...

Cinch Connectors announced its Low Profile Board-to-Board Connectors. Designed for applications requiring low profile, compact footprint interconnects between printed circuit boards or components, the...

Weidmüller has created a housing concept with the name JACKPAC. Equipped with M12 connections, it is designed for high-class protection to IP 67/68. It can be used to advantage in mechanical and syste...