Application guidelines for board mounted power supplies The High Density Packaging (HDP) User Group announces the launch of the Board Mounted Power Supply (BMPS) Application Guidelines. The 148-page document is designed to support the communications and electronics manufacturing industry by promoting understanding of BMPS products. Originally started as a project within the Power Sources Manufacturers Association (PSMA) in 2002, the activity was incorporated into an HDP User Group Project in 2005. Since then major users and manufacturers of BMPS products, have worked to define the market’s requirements with respect to such products and to communicate manufacturers’ capabilities for meeting these requirements. The BMPS Application Guidelines document is the result of their efforts.

Contributors to the document include Alcatel-Lucent, Ericsson, International Rectifier, NetPower Technologies, TDK Innoveta, Siemens Networks and Tyco Electronics. The document is endorsed by users and systems integrators including Alcatel-Lucent, Ericsson, Intel Corporation, Juniper Networks, Siemens Networks, and supported by the Power Sources Manufacturers Association (PSMA), the European Power Supply Manufacturers Association (EPSMA), Artesyn Technologies (Emerson), and TI (PowerTrends). The document is covering everything from basic topologies, power architectures, and reliability to today’s most topical issues, like digital power and energy savings.

The BMPS Application Guidelines document is available from the HDP User Group offices and on the HDP User Group web site. It is free to members of HDP User Group and to contributing BMPS manufacturers, and will be priced at 2500USD to the public. Members of EPSMA/PSMA will receive a discount.