The "Automotive IC-Design" International Cooperation forum will be held in Munich on the 25th of October 2005. It will be held by Bayern Innovativ in cooperation with the Fraunhofer Institut für Integrierte Schaltung IIS and the International Engineering Consortium IEC. The emphasis is on new chip technologies, powerful software tools, tailored design tools and innovations in new materials and the assembly and connection technologies.
Among the participants are companies such as BMW, Bosch, Bourns Sensors, Cadence, Cherry, Elmos, Epson, Fairchild, FhG IIS, FhG IZM, Infineon, Inova, Maxim, Melexis, MunEDA, Murata, Siemens, Siemens VDO, Texas Instruments and TRW Automotive.
The conference language is English. The number of available participant places is limited. The fees are 175 Euro plus VAT and include seminar documents, pause refreshments and snacks as well as entry to all programs of “Euro DesignCon”. This is also being held from the 24th – 27th October 2005 in the Arabella Sheraton and presents new technology developments on chip, board and system levels. In addition, lectures, discussion rounds and half-day tutorials as well as an exhibition are also held.
