SiGe Semiconductor announced a complete RF front-end module for Wi-Fi products designed to comply with the IEEE 802.11n draft specification. The SE2545A10 is a RF front-end module to integrate two full dual-band transmit/receive chains (2 x 2.4 GHz Tx, 2 x 5 GHz Tx, 2 x 2.4 GHz Rx, and 2 x 5 GHz Rx) required for Multiple Input, Multiple Output (MIMO) operation. The front-end module replaces up to 60 components, providing all of the circuitry required between the transceiver and the antenna in a single, chip-scale package. The complete, fully tested device simplifies test and manufacture compared to alternative approaches, which include discrete transmit/receive designs, or separate modules for each chain. SE2545A10 solves RF challenges associated with MIMO design When designing dual-band MIMO solutions, manufacturers face several challenges. The integration of multiple receive and transmit chains increases RF complexity, making it difficult to meet desired yields during test and manufacture. The SE2545A10 is based on a integrated architecture that is designed specifically to eliminate this challenge.

The device includes two dual-band transmit/receive chains, including the power amplifiers, power detectors, switches, diplexers, and associated matching. The RF ports are fully matched to 50Ohms, which simplifies PCB layout and the interface to the transceiver. The module is fully tested. The SE2545A10 is capable of +18dBm output power in 802.11b mode, +17dBm output power in 802.11g mode, and +15dBm output power in 802.11a mode. The device meets all ACPR requirements in 802.11b mode, and operates with an error vector magnitude of less than three percent while in 802.11g or 802.11a modes. The SE2545A10 also features a power detector for each band with 20dB of dynamic range for each transmit chain. The combination of the power detector and optimized internal matching results in performance that is 1-2dB better than discrete solutions. The SE2545A10 offers high efficiency at the required output powers to maximize battery life in portable consumer electronics. Operating in 802.11g mode, the SE2545A10 consumes just 135 mA @ 17 dBm. The device is equipped with power control features including separate digital enable control for each transmit chain.

The SE2545A10 is supplied in a lead-free chip-scale package measuring 10mm x 14mm x 1.1mm. This is roughly the size of most 802.11g solutions, and about 70 percent smaller than discrete implementations. The small size allows manufacturers to integrate the additional RF chains required of enhanced wireless products while accommodating shrinking form factors. The SE2545A10 is sampling now. A higher power variant of the SE2545A10 will be available later this year for access points and PCs.