Ansoft announced the availability of ePhysics v2. This latest version enhances ePhysics' 3D steady-state thermal, transient thermal and linear stress analyses coupling to HFSS and Maxwell 3D with dynamic-link co-simulation. The new capability allows engineers to simulate heating, stress and deformation consequences of high- and low-frequency electromagnetic fields. The ePhysics user interface, including design management front-end, 3D modeler, parametric control, simulation set-up and post-processing interfaces, have been migrated to the Ansoft desktop concept shared by HFSS and Maxwell 3D. Engineers can account for the thermal and mechanical quantities that significantly contribute to a design's overall performance directly within the Ansoft environment. Coupling ePhysics with Maxwell 3D provides the cross-disciplinary analysis required in the design of electromechanical devices.
Typical applications include the analysis of electric machines, power-generation systems, transformers, microelectromechanical systems (MEMS) and solenoids. HFSS with ePhysics is vital for applications such as high-speed packages, antennas, monolithic microwave integrated circuits (MMICs), high-power microwave devices, military and broadcast communications and biological heating with radio frequency (RF) sources. These analyses include high-power, temperature-induced stress and size changes of design components.
Features include:
- new Ansoft desktop interface Dynamic-link coupling with Maxwell 3D and HFSS, which includes automatic mapping of power loss and force densities integrated with adaptive meshing technology
- Multiple design couplings that may be "daisy chained" in the process of creating complex applications Maxwell Transient
- Thermal Transient HFSS Transient Sequence
- Thermal Transient Nonlinear thermal properties (conductivity vs. Temp)
- Anisotropic stress solution
- 64-bit solvers available
ePhysics is available immediately for PC and UNIX platforms.
