Chomerics Europe has been able to provide a solution to a thermal management application encountered on an automotive ECU using its silicone-based Therm-A-GAP T630G dispensable form-in-place gap filling material. Previous approaches considered included thermal interface pads, which can be expensive both in terms of component and assembly cost, and thermal greases that have limited thermal performance, are messy to apply, and have performance that may degrade over time. Being fully cured means that Therm-A-GAP T630G does not require a post application curing cycle. Usefully, the material is also re-workable, allowing the ECU to be taken apart and re-assembled without jeopardising thermal performance. The thixotropic nature T630G ensures that it remains at the interface over the life of the product, helping to maintain thermal performance. A further benefit is the low (less than 1 PSI/6.9 kPa) force required to deflect the material and create an effective thermal path between the device and chassis or housing.