Chomerics has introduced two thermally conductive gap filling materials that combine low force deflection and thermal conductivity to provide a solution that gives a level of thermal management that meets the needs of the majority of applications. THERM-A-GAP 570 and 580 consist of a highly conformable, ultra-soft silicone elastomer filled with ceramic particles. The materials are able to blanket highly uneven surfaces to provide a thermally efficient interface between heat generating components or PCBs, and heat spreading or dissipating surfaces such as metal enclosures, heat sinks or the equipment chassis. Typical applications for THERM-A-GAP 570 and 580 can be found in telecoms, computing and automotive modules. THERM-A-GAP 570 is blue in colour, THERM-A-GAP 580 is yellow. Both materials are available with either an aluminium foil or fibreglass carrier. Aluminium foil versions are coated with a pressure sensitive adhesive on one side that helps placement accuracy. A choice of material thicknesses from 0.5mm to 5mm coupled with the ease with which the material can be compressed, means that a suitable variant can be found for most applications. Both materials also provide a degree of electrical isolation with a quoted dielectric strength of 200V/mil.
