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   CHANNEL-E ELECTRONICS EUROPE





Gap filling material 04-06-10


Chomerics Europe has introduced a thermally efficient gap filling material that combines heat conducting properties with the ability to conform to mating surfaces at low assembly pressures. THERM-A-GAP HCS10 is available in sheet form and provides a cost-effective thermal management solution in applications such as desktop and laptop computers, telecoms equipment and automotive electronics modules.

 

Available in thicknesses of between 0.5mm and 5.0mm, the material can perform a dual thermal management and vibration dampening role. It is especially useful in assemblies with large tolerance stack-up problems or where heat generating components need to be coupled to a chassis or heatsink. Ease of use and strength of the new RoHS compliant material is enhanced by the inclusion of a smooth fibreglass reinforcement layer on one side.

 

A deflection of 26% at an assembly pressure of just 5psi underlines the material’s suitability for use in equipment with delicate components or where low closure force ‘snap together’ housings are used. THERM-A-GAP HCS10 has a operating temperature range of -55°C to +200°C making it suitable for use in the most demanding indoor and outdoor applications.

 
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