Infineon Technologies and Mitsubishi Electric agreed to establish a service agreement by which they will both serve the industrial motion controls and drives market worldwide as sources for the advanced IGBT module packages SmartPACKs and SmartPIMs.

This package concept, recently developed by Infineon, will be available with the latest generation of power chip technologies from the two partners. Under this agreement, Mitsubishi Electric will market its latest generation power chips of various ratings (current range: 15A up to 150A, voltage class: 600V and 1200V) in the Smart-1,-2 and -3 housings of Infineon.

As the creator of the SmartPACK/PIM module concept, Infineon will continue to manufacture and supply the same range of fully compatible products using its own chip technologies and module manufacturing. Users of SmartPACK/-PIM will now benefit from the new cooperation of two worldwide leading IGBT module manufactures.