Vincotech has extended its range of MiniSKiiP PACK modules with IGBT4 versions covering 8A to 150A for 1200V in three different housings. Designed for solderless assembly, the modules are a choice for a second source for Semikron’s product range. The modules use the Infineon IGBT4 chip technology to improve EMC. They are available in three sizes targeting motor drive applications with up to 40 kW as well as power generation and UPS installations.

Available sizes

• MiniSKiiP 1 PACK - size 1 (42mm x 40mm) covering 8A, 1200V to 25A, 1200V
• MiniSKiiP 2 PACK - size 2 (59mm x 52mm) covering 35A, 1200V to 70A, 1200V
• MiniSKiiP 3 PACK - size 3 (82mm x 59 mm) covering 50A, 1200V to 100A, 1200V

These modules incorporate a 3-phase output inverter (SixPack topology) and an additional thermistor for temperature measurement. All products are also available on demand with pre-applied thermal grease for a perfect junction to the heat sink, as well as with lids in two different heights. Vincotech modules are pin-compatible with the previous versions of modules to enable upgrading. They are also compatible with their Semikron equivalents.