Infineon Technologies and Fairchild Semiconductor announced a packaging partnership for their power MOSFETs in the Infineon PowerStage 3x3 or Fairchild MLP 3x3 (Power33) packages. The compatibility agreement is in response to the need for supply security while balancing the drive towards efficiency and thermal performance in DC-DC conversion. It takes advantage of the expertise both companies offer for asymmetric, dual and single MOSFETs for DC-DC applications from 3A to 20A.