Fairchild Semiconductor introduces the FDMF8700, the first model in a new suite of integrated “FET Plus Driver Multi-chip Modules” for use in high-current synchronous buck applications supporting Intel’s DrMOS Vcore DC-DC converter standard. The FDMF8700 is a fully integrated power-stage solution offered in a space-saving 8 x 8mm micro-lead frame (MLP) package. By replacing a 12V driver IC and three N-channel MOSFETs, the FDMF8700 saves 50 percent board space compared to discrete component solutions. The layout and size of the switches and driver die are optimized to enable higher-frequency operation and are intended for use in desktop and server VR11.x vCore conversion, high-current DC-DC point-of-load converters and small form factor voltage regulator modules.

The FDMF8700 enables designers to maximize footprint power density, reduce component part count/BOM cost and shorten time to market. Unlike discrete solutions whose parasitic elements combined with board layout significantly reduce system efficiency, the FDMF8700 module is designed to both thermally and electrically minimize parasitic effects and improve overall system efficiency. In operation, the high-side MOSFET is optimized for fast switching while the low-side device is optimized for low RDS(on). This arrangement accommodates the low-duty-cycle switching requirements needed to convert the 12V bus to supply the processor core with 1.0V to 1.2V at up to 30A. Fairchild’s MLP 8x8 power package extends the concept of enhanced packaging for DC-DC converter applications. The integrated FDMF8700 module provides an additional efficiency gain of 1.5 to 2 percent for peak- and steady-power levels compared to discrete solutions using D-Pak packaging.

The FDMF8700 is available in a 56-pin (8 mm x 8 mm) MLP. This lead (Pb)-free product meets or exceeds the requirements of the joint IPC/JEDEC standard J-STD-020C and is compliant with European Union regulations now in effect. The price (each, 1000 pcs) is US$ 2.50.