Bergquist’s Gap Filler 2000 is a thermally conductive, electrically isolating, liquid gap filling material supplied as a two – component room or elevated temperature curing system. Unlike cured gap filling materials, the liquid approach provides infinite thickness with little or no stress during displacement and assembly. It also eliminates the need for specific pad thickness and die cut shapes for individual applications. It is used in thermal interface applications when a strong structural bond is not required. Gap Filler 2000 is formulated for low modulus, ‘gel like’ properties. Typical applications include automotive electronics, computers and peripherals, telecommunications and any other assembly where a heat generating semiconductor must be efficiently thermally bonded to a heatsink. In addition, Gap Filler 2000’s low modulus property gives it stress absorbing flexibility. It has a thermal conductivity of 2.0W/m-K.

The material provides a balance of cured material properties and good compression set (memory). The result is a soft, form-in-place elastomer ideal for coupling ‘hot’ electronic components mounted on PC boards with an adjacent metal case or heatsink. Before cure, it flows under pressure like a grease. After curing it does not pump out from the interface as a result of thermal cycling. Unlike thermal grease, the cured product is dry to the touch. Bergquist and preferred partners also provide a complete range of dispensing equipment and expertise to enable the material to be easily implemented in the production environment. In addition, Gap Filler 2000 allows ‘clean-release’ from many heatsink and electronic packaging materials, so reworking of the components is possible. It has an excellent low and high temperature mechanical and chemical stability with a continuous use temperature range of -60 to 200ºC and is available with or without spacer beads to ensure a minimum stand-off. Gap Filler 2000 is supplied as a two-part kit comprised of Part A and Part B components. The two components are coloured to assist as a mix indicator (1:1 ratio by weight or volume).

Curing can take place at ambient or can be accelerated by using elevated temperatures to form a soft thermally conductive interface material. The cure results in 100% solids with no by-products and can be completed in as little as five minutes at 100ºC.