Cinch Connectors announced its Low Profile Board-to-Board Connectors. Designed for applications requiring low profile, compact footprint interconnects between printed circuit boards or components, the Connectors offer a height of 0.81mm in custom, flexible footprint configurations with contact spacing as close as 1.0mm. In addition, the connectors provide high speed performance, easily supporting signal speeds in excess of 20 Ghz with contact resistance less than 25 mOhm. The Low Profile Connectors utilize proven CIN::APSE contact technology, a solderless wound-wire contact. Available in contact counts ranging from less than 10 contacts to over 2,000, the Connectors can be custom configured in patterns of arrays or individual contacts depending on the unique demands of an application. The combination of mechanical and electrical features makes the Low Profile Connectors an choice for RF Board-to-Board assemblies, Low-Profile Mezzanine Boards, and High-Performance Component-to-Board assemblies in Computer, Communications and Medical Electronics market applications.
