Vincotech will add the latest Mitsubishi IGBT technology to its range of MiniSKiiP PIM modules. The new modules feature Mitsubishi Generation 6 chips ranging from 15A, 1200 V to 100A, 1200V. They come in three different housings. The MiniSKiiP PIM modules are available in three sizes for motor drive applications ranging up to 30kW:

• MiniSKiiP size 1 (42mm by 40mm) for 15A, 1200V
• MiniSKiiP size 2 (59mm by 52mm) for 25A, 1200V to 35A, 1200V
• MiniSKiiP size 3 (82mm by 59mm) for 50A, 1200 V to 100A, 1200V

All modules feature a 3-phase input rectifier, a 3-phase output inverter, a brake chopper, and an added thermistor to measure temperatures (PIM topology). Pins match the previous version’s array to enable upgrading. The modules will also be offered with pre-applied thermal grease. Samples are in the works for September 2011, with serial production slate for Q1 2012. (MiniSKiiP is a registered trademark of Semikron.)