SiConnect, an in-home powerline communications company, announced first-time working silicon for its powerline transceiver, and plans to start benchmarking the device. The news coincides with the announcement of a further investment in the company of £2.8 million from existing investors Esprit Capital Partners, TTP Ventures and Dow Venture Capital. SiConnect is now on course to be sampling its first product during Q4 ‘2006 and moving to volume availability in Q1 ‘2007. The company selected Chartered Semiconductor’s 0.18-micron HV CMOS process for its first chip implementation and Unisem for die packaging.