search 
 
 
 
 
 
 

   CHANNEL-E ELECTRONICS EUROPE





Qimonda insolvency: Settlement with U.S. subsidiaries 25-10-10


Concerning the assets of Qimonda AG the insolvency administrator Dr. Michael Jaffé has reached a settlement with the company’s U.S. subsidiaries Qimonda North America and Qimonda Richmond over disputed claims. At the same time, the U.S. subsidiaries confirmed that Qimonda AG owns certain patents and patent applications.

 

The U.S. subsidiaries, which had filed for Chapter 11 bankruptcy protection under the U.S. Bankruptcy Code, had asserted claims of over $2.1 billion against Qimonda AG. Qimonda AG, in turn, had filed claims of more than $1.7 billion against the U.S. subsidiaries. The U.S. subsidiaries subsequently sued the parent company in the U.S. Bankruptcy Court in Delaware. As a result of a mediation in London both parties reached an agreement on the mutual claims.

 

The two U.S. companies also had disputed the parent’s ownership of over 800 patents and patent applications in an action before the U.S. Bankruptcy Court. Following lengthy negotiations, Qimonda North America and Qimonda Richmond have now abandoned any claims to prior or future ownership and acknowledge Qimonda AG as the absolute owner of these patents and patent applications.

 

Qimonda AG had filed for insolvency at the District Court in Munich on 1 April 2009. Dr. Michael Jaffé was subsequently appointed insolvency administrator. The company can now use the semiconductor IP portfolio with 9,000 patents and a large number of patent applications worldwide without restriction.

 

The creditors’ committees and the U.S. Bankruptcy Court in Delaware responsible for the US companies have approved the settlement. Now the insolvency administrator is continuing to exploit the patent portfolio by licensing and selling individual packages.

 
RECENT BUSINESS NEWS

Osram builds new LED assembly plant in China

European semiconductor distribution in Q1/2012

Premier Farnell changes CEO

Silicon Labs acquires Ember

Mentor Graphics: new head of Embedded Runtime Solutions

Digi-Key launches website for Israel

Digi-Key and T-Global Technology sign distribution agreement


RECENT PRODUCT NEWS

Vacuumschmelze: Advanced materials for electric motors

GSM/GPRS module in LCC package

XP Power: product compliance to 3rd edition medical safety standards

Tested 8-bit and 32-bit ARM Based MCUs in die form

Epson: display controller IC reference design

Eighth-brick DC/DC converters with 2,250 VDC isolation

Sharp: LED arrays with 1150 - 1550 Lumen


Copyright © channel-e IMPRINT |  PRIVACY