search 
 
 
 
 
 
 

   CHANNEL-E ELECTRONICS EUROPE





Renesas Electronics closes Tokyo Device Division 30-06-11

Renesas Electronics will close the Tokyo Device Division (Ome, Tokyo) of Renesas Eastern Japan Semiconductor, a wholly owned subsidiary of Renesas Electronics, near the end of March 2012. Renesas plans to proceed with the necessary measures while consulting with customers, including transferring production volume at the Tokyo Device Division to other Renesas manufacturing sites and discontinuing part of the products.

 

The company also plans to accumulate excess production by front-loading the production schedule for those products that require time to shift production to alternate sites.

 

Since its establishment in 1963 as Ome Electronics Kogyosho, the Tokyo Device Division of Renesas Eastern Japan Semiconductor has specialized in the assembly and test of devices such as transistors, analog ICs, LCD drivers, and memory devices. Its semiconductor assembly operations focus on large-capacity memory products employing multilayer chip-stacking technology and single-wafer testing technology.

 

In addition to back-end production for Renesas Electronics, the Tokyo Device Division has taken steps to expand its contract production business by leveraging the exclusive technologies mentioned above. However, the rise of overseas competitors, particularly in Asia, has led to fierce competition and an extremely unfavorable business climate.

 

Talks are planned between labor and management regarding the treatment of the employees of the Tokyo Device Division following its closure.

 
RECENT BUSINESS NEWS

Osram builds new LED assembly plant in China

European semiconductor distribution in Q1/2012

Premier Farnell changes CEO

Silicon Labs acquires Ember

Mentor Graphics: new head of Embedded Runtime Solutions

Digi-Key launches website for Israel

Digi-Key and T-Global Technology sign distribution agreement


RECENT PRODUCT NEWS

Vacuumschmelze: Advanced materials for electric motors

GSM/GPRS module in LCC package

XP Power: product compliance to 3rd edition medical safety standards

Tested 8-bit and 32-bit ARM Based MCUs in die form

Epson: display controller IC reference design

Eighth-brick DC/DC converters with 2,250 VDC isolation

Sharp: LED arrays with 1150 - 1550 Lumen


Copyright © channel-e IMPRINT |  PRIVACY