The global industry association SEMI has published six new technical standards applicable to the semiconductor, flat panel display (FPD) and MEMS manufacturing industries. The standards, developed by technical experts from equipment and materials suppliers, device manufacturers and other companies participating in the SEMI International Standards Program, are available for purchase in CD-ROM format or can be downloaded from the SEMI website. SEMI Standards are published three times a year. The new standards, part of the June 2007 publication cycle, join more than 740 standards that have been published by SEMI during the past 34 years. The standards released today include specifications for bar code container identification, specifications for silicon-on-insular (SOI) wafers, and a test method for surface hardness of FPD polarizing film. In addition to the six new standards, SEMI revised a previously published standard on EHS guidelines for exhaust ventilation of semiconductor manufacturing equipment. The revised SEMI S6 offers significantly more detailed guidance and provides equipment suppliers, evaluators and users a means of validating the adequacy of exhaust ventilation.

 The new standards released include:

• SEMI C61: Specification for Bar-Code Container Identification
• SEMI D49: Specification of Single Substrate Orientation for Loading/Unloading into/from Equipment to Specify ID Reader Position
• SEMI D50: Test Method for Surface Hardness of FPD Polarizing Film
• SEMI E148: Specification for the Definition of Time Synchronization Method and Format
• SEMI E149: Guide for Documentation Provided to the Equipment User for Use with Semiconductor Manufacturing Equipment
• SEMI M71: Specification for Silicon-On-Insulator (SOI) Wafers for CMOS LSI 130 nm Technology Generation and Beyond

The SEMI Standards Program, established in 1973, covers all aspects of semiconductor process equipment and materials, from wafer manufacturing to test, assembly and packaging, in addition to the manufacture of flat panel displays and micro-electromechanical systems (MEMS). About 1,100 volunteers worldwide participate in the program, which is made up of 17 global technical committees.