TSMC join Sematech, the international consortium of semiconductor manufacturers, as a core member. The cooperation will focus on advanced technology development to address some of the industry’s most pressing challenges. The company TSMC will join the consortium to collaborate on semiconductor research and development for IC process technologies for 20nm generation and beyond, including extreme ultra-violet (EUV) lithography, 3D interconnects, metrology, novel materials and device structures, and to develop critical infrastructure vital for next-generation manufacturing, including the transition to 450 mm wafer size.

Sematech manages an international network of collaborative partners, including foundries, IDMs, fabless, packaging and assembly companies, and material and equipment suppliers, to provide industry-wide solutions to the challenges of chip manufacturing.

TSMC is a semiconductor foundry. The Company’s managed capacity in 2010 totaled 11.33 million (8-inch equivalent) wafers, including capacity from two advanced 12-inch GIGAFABs, four eight-inch fabs, one six-inch fab, as well as TSMC’s wholly owned subsidiaries, WaferTech and TSMC China, and its joint venture fab, SSMC. Its corporate headquarters are in Hsinchu, Taiwan.