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Xilinx extends manufactering relationship with UMC and Toshiba to 65nm and below 06-12-05

Xilinx announced the extension of their relationship to include technology development at 65nm and below. In preparation for manufacture of next-generation Xilinx FPGAs, joint research and development efforts have resulted in 65nm prototype wafers, including actual programmable logic circuitry, currently being produced at UMC’s 300mm facility in Tainan, Taiwan. In addition, the companies announced that they are in the early stages of process definition for future development of 45nm FPGAs.

 

For more than a decade, Xilinx has relied upon UMC as its primary manufacturer for high-volume production of its programmable chips, most recently at 90nm. UMC leads all foundries in total 90nm wafers shipped and Xilinx supplies more than 70 percent of the world’s 90nm FPGAs, based upon cumulative revenues. A total of four 90nm FPGA families and 28 devices are being manufactured by UMC, including VirtexTM-4, SpartanTM-3E, Spartan-3L and Spartan-3. Early investment in 90nm technology development by both Xilinx and UMC led to delivery of the world’s first 90nm FPGA product line in 2003. To remain at the leading edge and to meet growing customer demand for its popular FPGAs, the company remains committed to a multi-source manufacturing strategy.

 

Furthermore Xilinx announced that they have entered into a joint development agreement for next-generation 65nm (nanometer)-generation FPGAs, which has resulted in successful production of 65nm FPGA prototype wafers, including actual programmable logic circuitries. Achievement of key 65nm joint development milestones is expected to lead to an expanded strategic foundry relationship.

Notably, Toshiba is among an elite few manufacturers worldwide that are now ready to produce 65nm products in volume, and the company is moving forward in research and development efforts at 45nm. The two companies will also investigate the possibility of continuing collaboration to include development of FPGAs based on Toshiba’s 45nm process technologies.

Successful execution of a 90nm manufacturing agreement – inked in October 2004 – paved the way for continued collaboration between Xilinx and Toshiba at 65nm. Xilinx flagship 90nm Virtex-4 platform FPGAs are produced in volume at Toshiba’s state-of-the-art 300-mm-wafer manufacturing plant at Oita, in Kyushu, Japan. The strategic foundry relationship with Toshiba not only assures Xilinx of another source of stable supply of cutting-edge FPGA products manufactured with the industry's most advanced process technology, it allows the company to rely on Toshiba’s expertise in integrating high-level design and process technology, a critical aspect of designing for advanced process geometries. The relationship also assures Toshiba of volume semiconductor business in the most advanced technology from one of the world’s leading fabless semiconductor companies, thereby underscoring the company’s leadership in a significant segment of the system large scale integration ( LSI) business.

 

 

 
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