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08. 12. 11 Film capacitors feature insertion heights of 15mm or 19mm

TDK-EPC has developed Epcos MKP and MKT film capacitors with low insertion heights. The capacitors of the B32*6T series with a lead spacing of 37.5mm feature insertion heights of 15mm or 19mm. These components are designed for rated voltages of between 63 and 2000VDC or 250 to 400VAC. Their capaci...

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08. 12. 11 Xilinx ships first Zynq-7000 devices

Xilinx announced its first Zynq-7000 Extensible Processing Platform (EPP) shipments to customers. The company is showcasing the first public demonstration of a Zynq-7000 EPP at the ARM European Technical Conference, where attendees can see the device running a Linux-based application. For syste...

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08. 12. 11 MCU family with RF transceiver and on-chip dc-dc converter

Silicon Laboratories introduced energy-efficient microcontroller (MCU) and wireless MCU solutions for power-sensitive embedded applications. The C8051F96x MCU and Si102x and Si103x wireless MCU families are based on low-power technology that enables 40 percent less system current draw and up to 65 p...

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07. 12. 11 Miniaturizied SMT RJ45 jack

Suyin has succeeded in further miniaturizing its RJ45 jack connectors for 10/100-Base-T and 100-Base-T4 applications. This makes it possible to develop PCBs that are even more densely populated yet feature a particularly low profile. The eight-pin type 100355XB008SX00ZL right-angle RJ45 jack design...

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